Metering head DOS P optimized for the application of thermal conductive materials
Electronic devices used in sectors such as automotive, communications or e-mobility are getting smaller and smaller with each new product generation. These trends lead to heat build-up, though only a small surface is available for its dissipation. How can the reliability and operation of these devices be guaranteed throughout its lifespan? One of the main ways to effectively dissipate the heat build-up is using thermo conductive materials such as gap fillers or thermo conductive adhesives. However, because of the high viscosity and abrasive fillers, measuring and dispensing those materials is a great challenge, especially in the context of manufacturing industrial processes where short cycle times are common.
As a solution to this problem we present the volumetric piston dispensing system Dos P from Scheugenpflug, optimized with new features which combine speed and accuracy to apply thermal conductive materials up to 3 times faster than the standard model.
Fig 1. New optimized piston metering system Dos P, which combines higher flow rates with the known and proven advantages of volumetric dispensing systems.
Thanks to design modifications, the system is now able to apply these type of materials faster and with high accuracy. This was proven in extensive trial series using a highly filled 2C silicone based gap filler. Depending on the application tested, the optimized Dos P system achieved accuracies of ± 0,03 g and ± 0,015 g. As a result, user benefit from faster cycle times at a sustained high precision and process reliability.
Fig 2. & 3. Trial series with a highly filled 2C silicone based gap filler. As shown in these samples, highest metering accuracy can be achieved with the optimized Dos P piston dispenser.
Fig 4. Compared to the standard model, the optimized Dos P dispensing system offers up to three times higher flow rates when dispensing thermally conductive materials.
The optimized Dos P system is also ideal for processing dispensing media sensitive to pressure, moisture or shear stress, without risking changes in the material properties.